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Fabrication of one-dimensional devices by a combination of AC dielectrophoresis and electrochemical deposition

Authors
Hong, S. H.Kang, M. G.Cha, H-YSon, M. H.Hwang, J. S.Lee, H. J.Sull, S. H.Hwang, S. W.Whang, D.Ahn, D.
Issue Date
12-3월-2008
Publisher
IOP PUBLISHING LTD
Citation
NANOTECHNOLOGY, v.19, no.10
Indexed
SCIE
SCOPUS
Journal Title
NANOTECHNOLOGY
Volume
19
Number
10
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/123905
DOI
10.1088/0957-4484/19/10/105305
ISSN
0957-4484
Abstract
We demonstrate a hybrid process for fabricating one-dimensional wire devices. The process is a combination of an alignment procedure using dielectrophoresis and subsequent contact metal formation utilizing electrochemical deposition with non-toxic organic-based Au electrolytes. Several devices have been successfully made from GaN nanowires or multi-walled carbon nanotubes (MWCNTs) using our hybrid technique. We demonstrate that rapid thermal annealing improves the ohmic characteristics by five orders of magnitude in the case of the GaN devices and similar to 300% in the case of the MWCNT devices. One of the reasons for this improvement is enhanced gold wetting due to the reduction of grain size at the annealing temperature.
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공과대학 (전기전자공학부)
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