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전기도금법을 이용한 반도체 배선소재용 저저항 소재 연구Research on low-resistance materials for semiconductor interconnect materials using electrodeposition method
- Alternative Title
- Research on low-resistance materials for semiconductor interconnect materials using electrodeposition method
- Authors
- Kim, Young Keun
- Issue Date
- 10-2월-2020
- Publisher
- 한국진공학회
- Citation
- 제58회 한국진공학회 동계정기학술대회
- Conference Name
- 제58회 한국진공학회 동계정기학술대회
- Place
- KO
- Conference Date
- 2020-02-09
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