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Low power Ti-doped NbO2-based selector device with high selectivity and low OFF current

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dc.contributor.authorJeon, Dong Su-
dc.contributor.authorDongale, Tukaram D.-
dc.contributor.authorKim, Tae Geun-
dc.date.accessioned2022-02-12T09:40:19Z-
dc.date.available2022-02-12T09:40:19Z-
dc.date.created2022-02-09-
dc.date.issued2021-12-05-
dc.identifier.issn0925-8388-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/135474-
dc.description.abstractThe crossbar array-based resistive memory is considered a potential architecture for high-density nonvolatile memory applications. However, the sneak current path problem associated with the crossbar array structure limits its use in practical applications. This limitation can be removed by employing a selector device in the crossbar array structure. Therefore, we propose NbO2 as a selector device as it operates at a rapid speed during the insulator-metal transition (IMT). Herein, we fabricated a Ti-doped NbO2 selector device and demonstrated a very low OFF current (5 x 10-11 A). The effect of Ti doping in the NbO2 device was studied by varying the Ti concentration during a radio frequency co-sputtering process. We intentionally prevented the formation of Nb2O5, and a high-quality NbO2 layer was deposited with an appropriate Ti concentration. Furthermore, we modulated the IMT characteristics of the NbO2 device by varying the Ti concentration. The fabricated Ti-doped NbO2 selector device showed an ION/IOFF ratio greater than 5 x 104. Additionally, a drift-free fast switching operation (< 20 ns) was achieved for the optimized selector device. These results suggest the high suitability of IMT-based NbO2 devices in selector applications. (c) 2021 Elsevier B.V. All rights reserved.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectNBO2-
dc.subjectTRANSITIONS-
dc.titleLow power Ti-doped NbO2-based selector device with high selectivity and low OFF current-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Tae Geun-
dc.identifier.doi10.1016/j.jallcom.2021.161041-
dc.identifier.scopusid2-s2.0-85109449373-
dc.identifier.wosid000686600400005-
dc.identifier.bibliographicCitationJOURNAL OF ALLOYS AND COMPOUNDS, v.884-
dc.relation.isPartOfJOURNAL OF ALLOYS AND COMPOUNDS-
dc.citation.titleJOURNAL OF ALLOYS AND COMPOUNDS-
dc.citation.volume884-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryChemistry, Physical-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusNBO2-
dc.subject.keywordPlusTRANSITIONS-
dc.subject.keywordAuthorCo-sputtering-
dc.subject.keywordAuthorCrossbar array-
dc.subject.keywordAuthorInsulator-metal transition-
dc.subject.keywordAuthorNbO2-
dc.subject.keywordAuthorResistive switching-
dc.subject.keywordAuthorTi doping-
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