Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks
DC Field | Value | Language |
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dc.contributor.author | Kim, Jeongah | - |
dc.contributor.author | Kim, Bo-Young | - |
dc.contributor.author | Park, Seong Dae | - |
dc.contributor.author | Seo, Ji-Hun | - |
dc.contributor.author | Lee, Chan-Jae | - |
dc.contributor.author | Yoo, Myong Jae | - |
dc.contributor.author | Kim, Youngmin | - |
dc.date.accessioned | 2022-02-26T12:40:19Z | - |
dc.date.available | 2022-02-26T12:40:19Z | - |
dc.date.created | 2022-02-07 | - |
dc.date.issued | 2021-08 | - |
dc.identifier.issn | 2072-666X | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/137012 | - |
dc.description.abstract | Because electronics are becoming flexible, the demand for techniques to manufacture thin flexible printed circuit boards (FPCBs) has increased. Conventional FPCBs are fabricated by attaching a coverlay film (41 mu m) onto copper patterns/polyimide (PI) film to produce the structure of coverlay/Cu patterns/PI film. Given that the conventional coverlay consists of two layers of polyimide film and adhesive, its thickness must be reduced to generate thinner FPCBs. In this study, we fabricated 25-mu m-thick poly(amide-imide-urethane)/epoxy interpenetrating networks (IPNs) to replace the thick conventional coverlay. Poly(amide-imide-urethane) (PAIU) was synthesized by reacting isocyanate-capped polyurethane with trimellitic anhydride and then mixed with epoxy resin to produce PAIU/epoxy IPNs after curing. Thanks to the soft segments of polyurethane, the elongation of PAIU/epoxy IPNs increased with increasing PAIU content and reached over 200%. After confirming the excellent thermal stability and chemical resistance of the PAIU/epoxy IPNs, we fabricated FPCBs by equipping them as coverlays. The mechanical durability of the FPCBs was evaluated through an MIT folding test, and the FPCB fabricated with PAIU/ep-2 was stable up to 164 folding cycles because of the balanced mechanical properties. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | MDPI | - |
dc.subject | POLYAMIDE-IMIDE | - |
dc.subject | FATIGUE RESISTANCE | - |
dc.subject | DIISOCYANATE | - |
dc.subject | POLY(AMIDE-IMIDE) | - |
dc.subject | POLYETHYLENE | - |
dc.subject | POLYIMIDES | - |
dc.subject | STRENGTH | - |
dc.subject | BLOCKING | - |
dc.subject | BEHAVIOR | - |
dc.subject | RESIN | - |
dc.title | Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Seo, Ji-Hun | - |
dc.identifier.doi | 10.3390/mi12080943 | - |
dc.identifier.scopusid | 2-s2.0-85112574773 | - |
dc.identifier.wosid | 000689393500001 | - |
dc.identifier.bibliographicCitation | MICROMACHINES, v.12, no.8 | - |
dc.relation.isPartOf | MICROMACHINES | - |
dc.citation.title | MICROMACHINES | - |
dc.citation.volume | 12 | - |
dc.citation.number | 8 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Analytical | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordPlus | BLOCKING | - |
dc.subject.keywordPlus | DIISOCYANATE | - |
dc.subject.keywordPlus | FATIGUE RESISTANCE | - |
dc.subject.keywordPlus | POLY(AMIDE-IMIDE) | - |
dc.subject.keywordPlus | POLYAMIDE-IMIDE | - |
dc.subject.keywordPlus | POLYETHYLENE | - |
dc.subject.keywordPlus | POLYIMIDES | - |
dc.subject.keywordPlus | RESIN | - |
dc.subject.keywordPlus | STRENGTH | - |
dc.subject.keywordAuthor | MIT folding test | - |
dc.subject.keywordAuthor | coverlay | - |
dc.subject.keywordAuthor | flexible printed circuit boards | - |
dc.subject.keywordAuthor | interpenetrating network | - |
dc.subject.keywordAuthor | poly(amide-imide-urethane) | - |
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