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Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks

Authors
Kim, JeongahKim, Bo-YoungPark, Seong DaeSeo, Ji-HunLee, Chan-JaeYoo, Myong JaeKim, Youngmin
Issue Date
8월-2021
Publisher
MDPI
Keywords
MIT folding test; coverlay; flexible printed circuit boards; interpenetrating network; poly(amide-imide-urethane)
Citation
MICROMACHINES, v.12, no.8
Indexed
SCIE
SCOPUS
Journal Title
MICROMACHINES
Volume
12
Number
8
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/137012
DOI
10.3390/mi12080943
ISSN
2072-666X
Abstract
Because electronics are becoming flexible, the demand for techniques to manufacture thin flexible printed circuit boards (FPCBs) has increased. Conventional FPCBs are fabricated by attaching a coverlay film (41 mu m) onto copper patterns/polyimide (PI) film to produce the structure of coverlay/Cu patterns/PI film. Given that the conventional coverlay consists of two layers of polyimide film and adhesive, its thickness must be reduced to generate thinner FPCBs. In this study, we fabricated 25-mu m-thick poly(amide-imide-urethane)/epoxy interpenetrating networks (IPNs) to replace the thick conventional coverlay. Poly(amide-imide-urethane) (PAIU) was synthesized by reacting isocyanate-capped polyurethane with trimellitic anhydride and then mixed with epoxy resin to produce PAIU/epoxy IPNs after curing. Thanks to the soft segments of polyurethane, the elongation of PAIU/epoxy IPNs increased with increasing PAIU content and reached over 200%. After confirming the excellent thermal stability and chemical resistance of the PAIU/epoxy IPNs, we fabricated FPCBs by equipping them as coverlays. The mechanical durability of the FPCBs was evaluated through an MIT folding test, and the FPCB fabricated with PAIU/ep-2 was stable up to 164 folding cycles because of the balanced mechanical properties.
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