On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kattan, Hammam | - |
dc.contributor.author | Chung, Sung Woo | - |
dc.contributor.author | Henkel, Joerg | - |
dc.contributor.author | Amrouch, Hussam | - |
dc.date.accessioned | 2022-02-28T06:42:40Z | - |
dc.date.available | 2022-02-28T06:42:40Z | - |
dc.date.created | 2022-02-09 | - |
dc.date.issued | 2021-07 | - |
dc.identifier.issn | 0272-1732 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/137225 | - |
dc.description.abstract | On-demand cooling is inevitable to maximize the processor's performance, while fulfilling thermal constraints-this holds more in advanced technologies, where localized hotspots change during runtime. In this work, we propose to adopt an array of thin-film thermoelectric (TE) devices, which is integrated within the chip packaging, for both cooling and energy-harvesting purposes. Each TE device within the array can be during the runtime enabled either for energy harvesting or on-demand cooling. Our approach is implemented and evaluated using a mature finite elements analysis tool in which a commercial multicore mobile chip is modeled after careful calibrations together with state-of-the-art TE devices. Results demonstrate that our approach reduces the peak temperature by up to 24 degrees C and the average temperature by 10 degrees C across various benchmarks with the cost of 67.5 mW. Additionally, the harvested energy from the array of TE devices compensates for 89% of the required cooling energy. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | IEEE COMPUTER SOC | - |
dc.title | On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Chung, Sung Woo | - |
dc.identifier.doi | 10.1109/MM.2021.3061335 | - |
dc.identifier.scopusid | 2-s2.0-85101782391 | - |
dc.identifier.wosid | 000670543100010 | - |
dc.identifier.bibliographicCitation | IEEE MICRO, v.41, no.4, pp.67 - 73 | - |
dc.relation.isPartOf | IEEE MICRO | - |
dc.citation.title | IEEE MICRO | - |
dc.citation.volume | 41 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 67 | - |
dc.citation.endPage | 73 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Computer Science | - |
dc.relation.journalWebOfScienceCategory | Computer Science, Hardware & Architecture | - |
dc.relation.journalWebOfScienceCategory | Computer Science, Software Engineering | - |
dc.subject.keywordAuthor | Energy harvesting | - |
dc.subject.keywordAuthor | Mobile devices | - |
dc.subject.keywordAuthor | Thermal management | - |
dc.subject.keywordAuthor | Thermoelectric | - |
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