On-Demand Mobile CPU Cooling With Thin-Film Thermoelectric Array
- Authors
- Kattan, Hammam; Chung, Sung Woo; Henkel, Joerg; Amrouch, Hussam
- Issue Date
- 7월-2021
- Publisher
- IEEE COMPUTER SOC
- Keywords
- Energy harvesting; Mobile devices; Thermal management; Thermoelectric
- Citation
- IEEE MICRO, v.41, no.4, pp.67 - 73
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE MICRO
- Volume
- 41
- Number
- 4
- Start Page
- 67
- End Page
- 73
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/137225
- DOI
- 10.1109/MM.2021.3061335
- ISSN
- 0272-1732
- Abstract
- On-demand cooling is inevitable to maximize the processor's performance, while fulfilling thermal constraints-this holds more in advanced technologies, where localized hotspots change during runtime. In this work, we propose to adopt an array of thin-film thermoelectric (TE) devices, which is integrated within the chip packaging, for both cooling and energy-harvesting purposes. Each TE device within the array can be during the runtime enabled either for energy harvesting or on-demand cooling. Our approach is implemented and evaluated using a mature finite elements analysis tool in which a commercial multicore mobile chip is modeled after careful calibrations together with state-of-the-art TE devices. Results demonstrate that our approach reduces the peak temperature by up to 24 degrees C and the average temperature by 10 degrees C across various benchmarks with the cost of 67.5 mW. Additionally, the harvested energy from the array of TE devices compensates for 89% of the required cooling energy.
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Collections - Graduate School > Department of Computer Science and Engineering > 1. Journal Articles
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