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A 80x60 Microbolometer CMOS Thermal Imager Integrated With a Low-Noise 12-B DAC

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dc.contributor.authorKim, Ki-Duk-
dc.contributor.authorPark, Seunghyun-
dc.contributor.authorLee, Byunghun-
dc.contributor.authorLee, Hyung-Min-
dc.contributor.authorCho, Gyu-Hyeong-
dc.date.accessioned2022-04-01T03:40:41Z-
dc.date.available2022-04-01T03:40:41Z-
dc.date.created2022-04-01-
dc.date.issued2022-08-
dc.identifier.issn0278-0046-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/139316-
dc.description.abstractA low-cost 80x60 microbolometer CMOS (complementary metal-oxide-semiconductor) thermal imager is presented. The imager system integrated with a proposed 12-b biasing digital-to-analog converter (DAC) has 100 ms start-up time, which is 300x faster than commercial products, while ensuring comparable 100 mK noise-equivalent temperature difference. The low-noise biasing DAC adopts a current-mode divider-stacking structure and a bit-inversion technique, leading to mismatch-insensitive operation. The 12-b biasing DAC in a 0.18 mu m CMOS imager IC has a low noise of 1.89 mu V-rms and INL (integral non-linearity)/DNL (differential non-linearity) of 0.14/0.09 LSB, respectively.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleA 80x60 Microbolometer CMOS Thermal Imager Integrated With a Low-Noise 12-B DAC-
dc.typeArticle-
dc.contributor.affiliatedAuthorLee, Hyung-Min-
dc.identifier.doi10.1109/TIE.2021.3109542-
dc.identifier.scopusid2-s2.0-85114744793-
dc.identifier.wosid000764880700104-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.69, no.8, pp.8604 - 8608-
dc.relation.isPartOfIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS-
dc.citation.titleIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS-
dc.citation.volume69-
dc.citation.number8-
dc.citation.startPage8604-
dc.citation.endPage8608-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaAutomation & Control Systems-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaInstruments & Instrumentation-
dc.relation.journalWebOfScienceCategoryAutomation & Control Systems-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryInstruments & Instrumentation-
dc.subject.keywordAuthorComputer architecture-
dc.subject.keywordAuthorCalibration-
dc.subject.keywordAuthorMicroprocessors-
dc.subject.keywordAuthorIntegrated circuits-
dc.subject.keywordAuthorVoltage measurement-
dc.subject.keywordAuthorLinearity-
dc.subject.keywordAuthorThermal noise-
dc.subject.keywordAuthorCMOS thermal imager-
dc.subject.keywordAuthordigital-to-analog converter (DAC)-
dc.subject.keywordAuthormicrobolometer-
dc.subject.keywordAuthornoise-equivalent temperature difference (NETD)-
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