A 80x60 Microbolometer CMOS Thermal Imager Integrated With a Low-Noise 12-B DAC
- Authors
- Kim, Ki-Duk; Park, Seunghyun; Lee, Byunghun; Lee, Hyung-Min; Cho, Gyu-Hyeong
- Issue Date
- 8월-2022
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Computer architecture; Calibration; Microprocessors; Integrated circuits; Voltage measurement; Linearity; Thermal noise; CMOS thermal imager; digital-to-analog converter (DAC); microbolometer; noise-equivalent temperature difference (NETD)
- Citation
- IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.69, no.8, pp.8604 - 8608
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
- Volume
- 69
- Number
- 8
- Start Page
- 8604
- End Page
- 8608
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/139316
- DOI
- 10.1109/TIE.2021.3109542
- ISSN
- 0278-0046
- Abstract
- A low-cost 80x60 microbolometer CMOS (complementary metal-oxide-semiconductor) thermal imager is presented. The imager system integrated with a proposed 12-b biasing digital-to-analog converter (DAC) has 100 ms start-up time, which is 300x faster than commercial products, while ensuring comparable 100 mK noise-equivalent temperature difference. The low-noise biasing DAC adopts a current-mode divider-stacking structure and a bit-inversion technique, leading to mismatch-insensitive operation. The 12-b biasing DAC in a 0.18 mu m CMOS imager IC has a low noise of 1.89 mu V-rms and INL (integral non-linearity)/DNL (differential non-linearity) of 0.14/0.09 LSB, respectively.
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