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Dynamic compressive deformation behavior of SiC-particulate-reinforced A356 Al alloy matrix composites fabricated by liquid pressing process

Authors
손석수
Issue Date
1월-2017
Publisher
ELSEVIER SCIENCE SA
Keywords
A356 Al alloy; Adiabatic heating; Liquid pressing process; SiC particulate; Split Hopkinson pressure bar; Strain rate hardening
Citation
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.680, pp.368 - 377
Indexed
SCIE
SCOPUS
Journal Title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume
680
Start Page
368
End Page
377
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/139859
DOI
10.1016/j.msea.2016.10.102
ISSN
0921-5093
Abstract
In this study, A356 Al alloy composites reinforced with SiC particulates (SiCp), whose SiCp volume fraction was quite high (about 56 vol%) for a candidate surface material of multi-layered armors, were fabricated by a liquid pressing process, and their dynamic compressive properties were investigated by using a split Hopkinson pressure bar. Defects such as misinfiltration or pores were eliminated, but about 2 vol% of eutectic Si particles and about 3 vol% of Fe-Al intermetallic compound particles were contained in the Al matrix. According to the dynamic compressive test results, dynamic compressive strength and strain were much higher than quasi-static ones because of strain-rate hardening effect and existence of molten Al matrix formed by adiabatic heating. The as-cast composite showed the best combination of dynamic strength and strain, together with the highest dynamic toughness, because the crack propagation was effectively blocked by the molten Al matrix and deformation band formation, while the T6-heat-treated composite showed the lowest compressive strain in spite of the highest strength. These findings suggested that the present Al-SiCp composites could be reliably applied to armors because the dynamic toughness or resistance to fracture was much higher under the dynamic
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공과대학 (신소재공학부)
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