A Personalized Electronic Tattoo for Healthcare Realized by On-the-Spot Assembly of an Intrinsically Conductive and Durable Liquid-Metal Composite
- Authors
- Lee, Gun-Hee; Woo, Heejin; Yoon, Chanwoong; Yang, Congqi; Bae, Jae-Young; Kim, Wonsik; Lee, Do Hoon; Kang, Heemin; Han, Seungmin; Kang, Seung-Kyun; Park, Seongjun; Kim, Hyung-Ryong; Jeong, Jae-Woong; Park, Steve
- Issue Date
- 8월-2022
- Publisher
- WILEY-V C H VERLAG GMBH
- Keywords
- bioelectronics; electronic tattoos; liquid-metal particles; personalized healthcare; solution processing
- Citation
- ADVANCED MATERIALS, v.34, no.32
- Indexed
- SCIE
SCOPUS
- Journal Title
- ADVANCED MATERIALS
- Volume
- 34
- Number
- 32
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/143337
- DOI
- 10.1002/adma.202204159
- ISSN
- 0935-9648
- Abstract
- Conventional electronic (e-) skins are a class of thin-film electronics mainly fabricated in laboratories or factories, which is incapable of rapid and simple customization for personalized healthcare. Here a new class of e-tattoos is introduced that can be directly implemented on the skin by facile one-step coating with various designs at multi-scale depending on the purpose of the user without a substrate. An e-tattoo is realized by attaching Pt-decorated carbon nanotubes on gallium-based liquid-metal particles (CMP) to impose intrinsic electrical conductivity and mechanical durability. Tuning the CMP suspension to have low-zeta potential, excellent wettability, and high-vapor pressure enables conformal and intimate assembly of particles directly on the skin in 10 s. Low-cost, ease of preparation, on-skin compatibility, and multifunctionality of CMP make it highly suitable for e-tattoos. Demonstrations of electrical muscle stimulators, photothermal patches, motion artifact-free electrophysiological sensors, and electrochemical biosensors validate the simplicity, versatility, and reliability of the e-tattoo-based approach in biomedical engineering.
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Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
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