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전단금형을 이용한 PCB depaneling 공정에 관한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Woo Chun Choi | - |
| dc.date.accessioned | 2021-08-28T13:25:19Z | - |
| dc.date.available | 2021-08-28T13:25:19Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2016-10-13 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/27202 | - |
| dc.publisher | 한국정밀공학회 | - |
| dc.title | 전단금형을 이용한 PCB depaneling 공정에 관한 연구 | - |
| dc.title.alternative | 전단금형을 이용한 PCB depaneling 공정에 관한 연구 | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | Woo Chun Choi | - |
| dc.identifier.bibliographicCitation | 한국정밀공학회, pp.393 | - |
| dc.relation.isPartOf | 한국정밀공학회 | - |
| dc.relation.isPartOf | 한국정밀공학회 논문집 | - |
| dc.citation.title | 한국정밀공학회 | - |
| dc.citation.startPage | 393 | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferenceDate | 2016-10-12 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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