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Effect of fluorine ions on wet etching behavior of copper/molybdenum in acidic solutions
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hong MunPyo | - |
| dc.date.accessioned | 2021-08-29T19:53:52Z | - |
| dc.date.available | 2021-08-29T19:53:52Z | - |
| dc.date.created | 2021-04-22 | - |
| dc.date.issued | 2012-07-06 | - |
| dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/45697 | - |
| dc.publisher | ICMAP 2012 (The 4th International Conference on Microelectronics and Plasma Technology) | - |
| dc.title | Effect of fluorine ions on wet etching behavior of copper/molybdenum in acidic solutions | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | Hong MunPyo | - |
| dc.identifier.bibliographicCitation | ICMAP 2012 (The 4th International Conference on Microelectronics and Plasma Technology) | - |
| dc.relation.isPartOf | ICMAP 2012 (The 4th International Conference on Microelectronics and Plasma Technology) | - |
| dc.relation.isPartOf | ICMAP 2012 (The 4th International Conference on Microelectronics and Plasma Technology) | - |
| dc.citation.title | ICMAP 2012 (The 4th International Conference on Microelectronics and Plasma Technology) | - |
| dc.citation.conferencePlace | KO | - |
| dc.citation.conferenceDate | 2012-07-04 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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