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Effect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migrationEffect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migration
- Alternative Title
- Effect of structure of biphenyl type epoxy with curing agent and curing condition on suppressing Cu migration
- Authors
- Yoon, Ho Gyu
- Issue Date
- 8-4월-2011
- Publisher
- 한국고분자학회
- Citation
- 2011년도 춘계 총회 및 학술대회
- Conference Name
- 2011년도 춘계 총회 및 학술대회
- Place
- KO
대전
- Conference Date
- 2011-04-07
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