Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
DC Field | Value | Language |
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dc.contributor.author | Kim, Woochang | - |
dc.contributor.author | Kim, Chihyun | - |
dc.contributor.author | Lee, Wonseok | - |
dc.contributor.author | Park, Jinsung | - |
dc.contributor.author | Kim, Duckjong | - |
dc.date.accessioned | 2021-08-30T03:29:52Z | - |
dc.date.available | 2021-08-30T03:29:52Z | - |
dc.date.created | 2021-06-18 | - |
dc.date.issued | 2021-02 | - |
dc.identifier.issn | 2218-273X | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/49673 | - |
dc.description.abstract | Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | MDPI | - |
dc.title | Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jinsung | - |
dc.identifier.doi | 10.3390/biom11020132 | - |
dc.identifier.scopusid | 2-s2.0-85099707653 | - |
dc.identifier.wosid | 000622118900001 | - |
dc.identifier.bibliographicCitation | BIOMOLECULES, v.11, no.2, pp.1 - 10 | - |
dc.relation.isPartOf | BIOMOLECULES | - |
dc.citation.title | BIOMOLECULES | - |
dc.citation.volume | 11 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 10 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Biochemistry & Molecular Biology | - |
dc.relation.journalWebOfScienceCategory | Biochemistry & Molecular Biology | - |
dc.subject.keywordAuthor | nano safety | - |
dc.subject.keywordAuthor | thermal interface material | - |
dc.subject.keywordAuthor | copper nanoparticle | - |
dc.subject.keywordAuthor | multi-dimensional filler | - |
dc.subject.keywordAuthor | high thermal conductivity | - |
dc.subject.keywordAuthor | low cost | - |
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