Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design
- Authors
- Kim, Woochang; Kim, Chihyun; Lee, Wonseok; Park, Jinsung; Kim, Duckjong
- Issue Date
- 2월-2021
- Publisher
- MDPI
- Keywords
- nano safety; thermal interface material; copper nanoparticle; multi-dimensional filler; high thermal conductivity; low cost
- Citation
- BIOMOLECULES, v.11, no.2, pp.1 - 10
- Indexed
- SCIE
SCOPUS
- Journal Title
- BIOMOLECULES
- Volume
- 11
- Number
- 2
- Start Page
- 1
- End Page
- 10
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/49673
- DOI
- 10.3390/biom11020132
- ISSN
- 2218-273X
- Abstract
- Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future.
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Collections - Graduate School > Department of Control and Instrumentation Engineering > 1. Journal Articles
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