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QUANTITATIVE TEMPERATURE AND THERMAL CONDUCTIVITY PROFILING WITH THERMOCOUPLE SCANNING THERMAL MICROSCOPE PROBE

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dc.contributor.authorKWON, Oh Myoung-
dc.date.accessioned2021-08-30T03:43:18Z-
dc.date.available2021-08-30T03:43:18Z-
dc.date.created2021-04-22-
dc.date.issued2009-06-30-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/49854-
dc.publisherAssembly of World Conferences on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics-
dc.subjectScanning thermal microscope, thermocouple probe, quantitative profiling, temperature, thermal conductivity-
dc.titleQUANTITATIVE TEMPERATURE AND THERMAL CONDUCTIVITY PROFILING WITH THERMOCOUPLE SCANNING THERMAL MICROSCOPE PROBE-
dc.typeConference-
dc.contributor.affiliatedAuthorKWON, Oh Myoung-
dc.identifier.bibliographicCitation7th World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics-
dc.relation.isPartOf7th World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics-
dc.citation.title7th World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics-
dc.citation.conferencePlacePL-
dc.citation.conferencePlaceKrakow, Poland-
dc.citation.conferenceDate2009-06-28-
dc.type.rimsCONF-
dc.description.journalClass1-
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