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Twin boundary sliding in single crystalline Cu and Al nanowires

Authors
Kim, Sung-HoonPark, Jun-HyoungKim, Hong-KyuAhn, Jae-PyoungWhang, Dong-MokLee, Jae-Chul
Issue Date
1-9월-2020
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Keywords
Nanoscale crystals; Deformation twinning; Plastic deformation; Boundary sliding; Face-centered cubic
Citation
ACTA MATERIALIA, v.196, pp.69 - 77
Indexed
SCIE
SCOPUS
Journal Title
ACTA MATERIALIA
Volume
196
Start Page
69
End Page
77
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/53212
DOI
10.1016/j.actamat.2020.06.028
ISSN
1359-6454
Abstract
Twin boundary sliding (TBS) is a deformation mode that is typically observed in nanocrystalline metals and usually occurs at multiple locations in the twinned region, including twin boundaries, of a crystal in a situation in which additional deformation via twinning is limited. Unlike the well-established dislocation slip and necking deformation process that occurs in large crystals, recent theories that explain TBS are often controversial, and much remains unsettled. Herein, we develop a factor that enables the prediction of deformation pathways by quantitatively analyzing the relative tendency for the formation of partial dislocations based on the dislocation and fault energy theories. The developed factor considers the effects of static/extrinsic features, such as the stacking fault energy (SFE) as well as the crystal size and orientation, and dynamic structural states characterized by the various fault energies of a material. The factor is initially validated using a Cu crystal exhibiting low SFE for various orientations and sizes. To determine whether the proposed factor can be generically extended to crystals with high SFE, we perform micro-mechanical tensile tests and molecular dynamics simulations on Al nanowires. The developed factor produces self-consistent results even for metals exhibiting different SFE values. The observations can be used as a guideline to design nanoscale structures for load-carrying applications. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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Lee, Jae chul
공과대학 (신소재공학부)
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