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Surface characteristics of sputtered Ta, Ti as barrier layer for copper deposition
- Authors
- BYUN, Dong Jin
- Issue Date
- 7-11월-2008
- Publisher
- 한국재료학회
- Citation
- 2008년도 한국재료학회 추계학술발표대회 및 제 15회 신소재 심포지엄
- Conference Name
- 2008년도 한국재료학회 추계학술발표대회 및 제 15회 신소재 심포지엄
- Place
- KO
- Conference Date
- 2008-11-07
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