Performance Comparison of InGaN-Based Phosphor Converted and AlGaInP-Based Red Light-Emitting Diode Packages for Vehicle Rear Fog Lamps
- Authors
- Kim, Ho-Young; Kang, Kyoung Mo; Lee, Jae Moon; Choi, Kwang-Ki; Oh, Jeong Tak; Jeong, Hwan-Hee; Seong, Tae-Yeon
- Issue Date
- 29-May-2020
- Publisher
- ELECTROCHEMICAL SOC INC
- Keywords
- LED - III-Nitrides; LED; light emitting diode; Solid State Lighting - Packaging
- Citation
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.9, no.5
- Indexed
- SCIE
SCOPUS
- Journal Title
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
- Volume
- 9
- Number
- 5
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/55622
- DOI
- 10.1149/2162-8777/ab937d
- ISSN
- 2162-8769
- Abstract
- We investigated the electrical and optical properties of chip LED and phosphor-converted red LED (pcR-LED) packages for a vehicle rear fog lamp application. The chip LED package had a lower forward voltage, narrower electroluminescence spectrum, and a larger view angle than the pcR-LED package. At 85 degrees C under 700 mA, the pcR-LED package emitted 26.8% more luminous flux than the chip LED package. After 1000 temperature cycles (-40 to +125 degrees C), the chip LED packages exhibited a 7.83% maintenance rate variance, whereas the pcR-LED packages showed a 2.78% change. Furthermore, after 1000 h under relative humidity conditions of 85 degrees C/85% both the samples demonstrated an average maintenance rate >98.66%. At 85 degrees C under 700 mA, it was demonstrated that the pcR-LED package exhibited a 48.9% lower thermal resistance (junction to package) than the chip LED package. Also for the chip LED package, the temperatures were 58.6 degrees C at the central region and 61.9 degrees C at its periphery, whereas the pcR-LED package had temperatures of 70.5 degrees C at the center and 55.8 degrees C at the periphery. Unlike the chip LED package, neither current nor temperature significantly affected the CIE coordinates of the pcR-LED packages. (C) 2020 The Electrochemical Society ("ECS"). Published on behalf of ECS by IOP Publishing Limited.
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Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
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