Characterization and Cu Electroless Plating of Laserdrilled Through-Wafer Via-holes in AlGaN HEMT and GaN/Al2O3
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Ji Hyun | - |
dc.date.accessioned | 2021-08-31T00:27:42Z | - |
dc.date.available | 2021-08-31T00:27:42Z | - |
dc.date.created | 2021-04-22 | - |
dc.date.issued | 2008-08-18 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/55953 | - |
dc.publisher | The Korean Vacuum Society | - |
dc.title | Characterization and Cu Electroless Plating of Laserdrilled Through-Wafer Via-holes in AlGaN HEMT and GaN/Al2O3 | - |
dc.type | Conference | - |
dc.contributor.affiliatedAuthor | Kim, Ji Hyun | - |
dc.identifier.bibliographicCitation | International Conference on Microelectronics and Plasma Technology | - |
dc.relation.isPartOf | International Conference on Microelectronics and Plasma Technology | - |
dc.citation.title | International Conference on Microelectronics and Plasma Technology | - |
dc.citation.conferencePlace | KO | - |
dc.citation.conferenceDate | 2008-08-18 | - |
dc.type.rims | CONF | - |
dc.description.journalClass | 2 | - |
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