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Characterization and Cu Electroless Plating of Laserdrilled Through-Wafer Via-holes in AlGaN HEMT and GaN/Al2O3
- Authors
- Kim, Ji Hyun
- Issue Date
- 18-8월-2008
- Publisher
- The Korean Vacuum Society
- Citation
- International Conference on Microelectronics and Plasma Technology
- Conference Name
- International Conference on Microelectronics and Plasma Technology
- Place
- KO
- Conference Date
- 2008-08-18
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