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Effects of Surfactant Concentration on Step Height Reduction of SiO2 in Chemical Mechanical Polishing with Ceria Slurry

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dc.contributor.authorLim, Dae-Soon-
dc.date.accessioned2021-08-31T02:18:39Z-
dc.date.available2021-08-31T02:18:39Z-
dc.date.created2021-04-22-
dc.date.issued2008-07-30-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/56334-
dc.publisherThe Hong Kong Polytechnic University-
dc.subjectCMP, SiO2, Ceria, Surfactant-
dc.titleEffects of Surfactant Concentration on Step Height Reduction of SiO2 in Chemical Mechanical Polishing with Ceria Slurry-
dc.typeConference-
dc.contributor.affiliatedAuthorLim, Dae-Soon-
dc.identifier.bibliographicCitationInternational Conference on Multifunctional Materials and Structures, pp.1494 - 1497-
dc.relation.isPartOfInternational Conference on Multifunctional Materials and Structures-
dc.citation.titleInternational Conference on Multifunctional Materials and Structures-
dc.citation.startPage1494-
dc.citation.endPage1497-
dc.citation.conferencePlaceHK-
dc.citation.conferencePlace홍콩(Polytechnic University-
dc.citation.conferenceDate2008-07-28-
dc.type.rimsCONF-
dc.description.journalClass1-
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