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Effects of Surfactant Concentration on Step Height Reduction of SiO2 in Chemical Mechanical Polishing with Ceria Slurry
- Authors
- Lim, Dae-Soon
- Keywords
- CMP, SiO2, Ceria, Surfactant
- Issue Date
- 30-7월-2008
- Publisher
- The Hong Kong Polytechnic University
- Citation
- International Conference on Multifunctional Materials and Structures, pp.1494 - 1497
- Conference Name
- International Conference on Multifunctional Materials and Structures
- Place
- HK
홍콩(Polytechnic University
- Conference Date
- 2008-07-28
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