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Flexible NiO nanocrystal-based resistive memory device fabricated by low-temperature solution-process
- Authors
- Yun, Hye-Won; Woo, Ho Kun; Oh, Soong Ju; Hong, Sung-Hoon
- Issue Date
- Feb-2020
- Publisher
- ELSEVIER
- Keywords
- Flexible ReRAM; NiO nanocrystal; Low-temperature process; Solution-process
- Citation
- CURRENT APPLIED PHYSICS, v.20, no.2, pp.288 - 292
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- CURRENT APPLIED PHYSICS
- Volume
- 20
- Number
- 2
- Start Page
- 288
- End Page
- 292
- ISSN
- 1567-1739
- Abstract
- In this study, a nickel oxide (NiO) nanocrystal (NC) based flexible resistive memory device is demonstrated at temperature as low as 180 degrees C by ligand exchange process. The fabricated device for flexible application with structure Ni/NiO/Ni on PI substrate exhibits excellent switching characteristics with low set/reset voltages and stable resistance values in both ON and OFF states for over 100 switching cycles of memory operation. Also, this flexible memory device shows stable resistive switching properties under compressive stress with bending radius to 10 mm and consecutive bending cycles. The ReRAM fabricated by a low-temperature solution-process shows potential for next generation flexible electronics.
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Related Researcher
- Oh, Soong Ju
- 공과대학 (Department of Materials Science and Engineering)