Effect of the Surface Morphology of Plated Printed Circuit Board on the Reliability of LED Packages
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Ho-Young | - |
dc.contributor.author | Kim, Min Su | - |
dc.contributor.author | Song, Yong Seon | - |
dc.contributor.author | Lee, Kwang Hee | - |
dc.contributor.author | Oh, Jeong Tak | - |
dc.contributor.author | Park, Kwang Ho | - |
dc.contributor.author | Jeong, Hwan-Hee | - |
dc.contributor.author | Seong, Tae-Yeon | - |
dc.date.accessioned | 2021-08-31T14:40:16Z | - |
dc.date.available | 2021-08-31T14:40:16Z | - |
dc.date.created | 2021-06-18 | - |
dc.date.issued | 2020-01-08 | - |
dc.identifier.issn | 2162-8769 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/58335 | - |
dc.description.abstract | We investigated the effect of the surface roughness of the differently plated printed circuit board (PCB) on the reliability of AlGaInP-based LED packages. The electroless-plated PCB exhibited smoother surface than the electrolytic-plated one. Maximum debonding forces depended on the aspect ratios of hillocks on the plated PCB and voids. Thermo-mechanical maximum stress increased with increasing roughness height. For LED packages with the electroless-plated PCB, thermal resistance (R-th) from junction to PCB was increased by 57.43 K W(-1)after operation at 85 degrees C with 35 mA for 1000 h (reliability test), whereas for LED package with the electrolytic-plated PCB, R(th)from junction to PCB increased by 4.1 K/W. The temperatures of the chip areas of the electroless-plated and electrolytic-plated samples were 91.3 and 85.3 degrees C, respectively, after the reliability test. For the electroless-plated and electrolytic samples, the view angles along the X and Y axes were 144.43 degrees and 142.87 degrees, and 143.23 degrees and 145.58 degrees, respectively, after the reliability test. Unlike the electrolytic-plated samples, the electroless-plated samples experienced 4.8% drop in the lumen maintenance and delamination between the mold resin and PCB after operation under the 60 degrees C/90% relative humidity condition with 35 mA for 1000 h. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.subject | LIGHT-EMITTING-DIODES | - |
dc.subject | DELAMINATION | - |
dc.subject | TRANSPARENT | - |
dc.subject | SOLDER | - |
dc.title | Effect of the Surface Morphology of Plated Printed Circuit Board on the Reliability of LED Packages | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Seong, Tae-Yeon | - |
dc.identifier.doi | 10.1149/2162-8777/aba915 | - |
dc.identifier.scopusid | 2-s2.0-85091255245 | - |
dc.identifier.wosid | 000561382800001 | - |
dc.identifier.bibliographicCitation | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.9, no.6 | - |
dc.relation.isPartOf | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.citation.title | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.citation.volume | 9 | - |
dc.citation.number | 6 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | LIGHT-EMITTING-DIODES | - |
dc.subject.keywordPlus | DELAMINATION | - |
dc.subject.keywordPlus | TRANSPARENT | - |
dc.subject.keywordPlus | SOLDER | - |
dc.subject.keywordAuthor | Solid State Lighting | - |
dc.subject.keywordAuthor | Packaging | - |
dc.subject.keywordAuthor | LED | - |
dc.subject.keywordAuthor | light emitting diode | - |
dc.subject.keywordAuthor | electrolytic plating | - |
dc.subject.keywordAuthor | electroless plating | - |
dc.subject.keywordAuthor | surface roughness | - |
dc.subject.keywordAuthor | printed circuit board | - |
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