Effect of the Surface Morphology of Plated Printed Circuit Board on the Reliability of LED Packages
- Authors
- Kim, Ho-Young; Kim, Min Su; Song, Yong Seon; Lee, Kwang Hee; Oh, Jeong Tak; Park, Kwang Ho; Jeong, Hwan-Hee; Seong, Tae-Yeon
- Issue Date
- 8-1월-2020
- Publisher
- ELECTROCHEMICAL SOC INC
- Keywords
- Solid State Lighting; Packaging; LED; light emitting diode; electrolytic plating; electroless plating; surface roughness; printed circuit board
- Citation
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.9, no.6
- Indexed
- SCIE
SCOPUS
- Journal Title
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
- Volume
- 9
- Number
- 6
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/58335
- DOI
- 10.1149/2162-8777/aba915
- ISSN
- 2162-8769
- Abstract
- We investigated the effect of the surface roughness of the differently plated printed circuit board (PCB) on the reliability of AlGaInP-based LED packages. The electroless-plated PCB exhibited smoother surface than the electrolytic-plated one. Maximum debonding forces depended on the aspect ratios of hillocks on the plated PCB and voids. Thermo-mechanical maximum stress increased with increasing roughness height. For LED packages with the electroless-plated PCB, thermal resistance (R-th) from junction to PCB was increased by 57.43 K W(-1)after operation at 85 degrees C with 35 mA for 1000 h (reliability test), whereas for LED package with the electrolytic-plated PCB, R(th)from junction to PCB increased by 4.1 K/W. The temperatures of the chip areas of the electroless-plated and electrolytic-plated samples were 91.3 and 85.3 degrees C, respectively, after the reliability test. For the electroless-plated and electrolytic samples, the view angles along the X and Y axes were 144.43 degrees and 142.87 degrees, and 143.23 degrees and 145.58 degrees, respectively, after the reliability test. Unlike the electrolytic-plated samples, the electroless-plated samples experienced 4.8% drop in the lumen maintenance and delamination between the mold resin and PCB after operation under the 60 degrees C/90% relative humidity condition with 35 mA for 1000 h.
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Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
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