PLASMA PARAMETERS AND SiO2 ETCHING KINETICS IN C4F8
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Efremov, A. M. | - |
dc.contributor.author | Betelin, V. B. | - |
dc.contributor.author | Kwon, K. -H. | - |
dc.date.accessioned | 2021-08-31T16:06:06Z | - |
dc.date.available | 2021-08-31T16:06:06Z | - |
dc.date.created | 2021-06-19 | - |
dc.date.issued | 2020 | - |
dc.identifier.issn | 0579-2991 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/58994 | - |
dc.description.abstract | The effect of Ar/O-2 mixing ratio on plasma parameters, steady-state densities of active species and SiO2 etching kinetics in the three-component C4F8+Ar+O-2 gas mixture was studied under typical conditions of reactive ion etching process (inductive 13.56 MHz RF discharge, total gas pressure of 6 mTorr, input power of 700 W and bias power of 200 W). The investigation combined etching rate measurements, plasma diagnostics by Langmuir probes and 0-dimensional (global) plasma modeling in order to determine steady-state densities and fluxes of plasma active species. It was found that the full substitution of Ar for O-2 at constant fraction of fluorocarbon gas (in fact, the transition from 50% C4F8 + 50% Ar to 50% C4F8 + 50% O-2 gas system): 1) results in weakly non-monotonic (with a maximum) SiO2 etching rate with close values for both O-2-free and Ar-free plasmas; 2) causes the monotonic decrease in both F atom flux and ion energy flux; and 3) suppresses the formation of the fluorocarbon polymer film on the etched surface through its oxidative destruction pathway. The model-based analysis of SiO2 etching kinetics allowed one to conclude that an increase in effective probability for SiO2 + F reaction contradicts with the behavior ion energy flux as well as demonstrate the agreement with the change in gas-phase parameters characterizing the fluorocarbon film thickness. Therefore, an increase in O-2 content in a feed gas influences the effective reaction probability by decreasing fluorocarbon film thickness and providing better access of F atoms to the etched surface. | - |
dc.language | Russian | - |
dc.language.iso | ru | - |
dc.publisher | IVANOVSKOGO KHIMIKO-TEKHNOLOGI TSHESKOGO INST | - |
dc.subject | INDUCTIVELY-COUPLED PLASMAS | - |
dc.subject | SURFACE KINETICS | - |
dc.subject | SILICON-NITRIDE | - |
dc.subject | MECHANISM | - |
dc.title | PLASMA PARAMETERS AND SiO2 ETCHING KINETICS IN C4F8 | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kwon, K. -H. | - |
dc.identifier.doi | 10.6060/ivkkt.20206306.6163 | - |
dc.identifier.scopusid | 2-s2.0-85088152102 | - |
dc.identifier.wosid | 000533610300006 | - |
dc.identifier.bibliographicCitation | IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA, v.63, no.6, pp.37 - 43 | - |
dc.relation.isPartOf | IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA | - |
dc.citation.title | IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII KHIMIYA I KHIMICHESKAYA TEKHNOLOGIYA | - |
dc.citation.volume | 63 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 37 | - |
dc.citation.endPage | 43 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
dc.subject.keywordPlus | INDUCTIVELY-COUPLED PLASMAS | - |
dc.subject.keywordPlus | SURFACE KINETICS | - |
dc.subject.keywordPlus | SILICON-NITRIDE | - |
dc.subject.keywordPlus | MECHANISM | - |
dc.subject.keywordAuthor | SiO2 | - |
dc.subject.keywordAuthor | etching | - |
dc.subject.keywordAuthor | polymerization | - |
dc.subject.keywordAuthor | fluorine atom flux | - |
dc.subject.keywordAuthor | ion energy flux | - |
dc.subject.keywordAuthor | effective reaction probability | - |
dc.subject.keywordAuthor | etching yield | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.