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3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

Authors
Jo, MansikBae, SeunghwanOh, InjongJeong, Ji-hunKang, ByungsooHwang, Seok JoonLee, Seung S.Son, Hae JungMoon, Byung-MooKo, Min JaeLee, Phillip
Issue Date
11월-2019
Publisher
AMER CHEMICAL SOC
Keywords
3D printing encapsulation; stretchable electronics; areal coverage; hidden origami; fused deposition modeling
Citation
ACS NANO, v.13, no.11, pp.12500 - 12510
Indexed
SCIE
SCOPUS
Journal Title
ACS NANO
Volume
13
Number
11
Start Page
12500
End Page
12510
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/62006
DOI
10.1021/acsnano.9b02362
ISSN
1936-0851
Abstract
Stretchability and areal coverage of active devices are critical design considerations of stretchable or wearable photovoltaics and photodetections where high areal coverages are required. However, simultaneously maximizing both properties in conventional island-bridge structures through traditional two-dimensional manufacturing processes is difficult due to their inherent trade-offs. Here, a 3D printer-based strategy to achieve extreme system stretchability and high areal coverage through combining fused deposition modeling (FDM) and flexible conductive nanocomposites is reported. Distinguished from typical approaches of using conductive filaments for FDM which have a flexibility dilemma and conductivity trade-offs, the proposed axiomatic approach to embed a two-dimensional silver nanowire percolation network into the surfaces of flexible 3D printed structures offers sufficient conductivity and deformability as well as additional benefits of electrical junction enhancement and encapsulation of silver nanowires. Kirigami/origami-pattern-guided three-dimensional arrangements of encapsulated interconnections provide efficient control over stretchability and areal coverage. The suggested process enables a perovskite solar module with an initial areal coverage of similar to 97% to be electrically and mechanically reversible with 400% system stretchability and 25 000% interconnect stretchability under the 1000 cycle test, by folding down or hiding the origami-applied interconnects under the islands. This 3D printing strategy of potentially low cost, large size capabilities, and high speed is promising for highly flexible future energy conversion applications.
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