CVD를 이용한 Cu 증착 시 plasma전처리로 인한 구조적 특성의 비교분석

BYUN, Dong Jin

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CVD를 이용한 Cu 증착 시 plasma전처리로 인한 구조적 특성의 비교분석

Authors: BYUN, Dong Jin

Publisher: 한국재료학회

Citation: 2009년도 한국재료학회 춘계학술발표대회 및 제 16회 신소재 심포지엄

URI: https://scholar.korea.ac.kr/handle/2021.sw.korea/64576

Conference Name: 2009년도 한국재료학회 춘계학술발표대회 및 제 16회 신소재 심포지엄

Place: KO

Conference Date: 2009-05-21

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Appears in Collections: College of Engineering > Department of Materials Science and Engineering > 2. Conference Papers

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