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electrical properties of Cu seed layer grown from Cu(dmamb)2

Authors
BYUN, Dong Jin
Publisher
경상대학교
Citation
international symposium on functional materials
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/65102
Conference Name
international symposium on functional materials
Place
KO
Conference Date
2009-06-15
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College of Engineering > Department of Materials Science and Engineering > 2. Conference Papers

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BYUN, Dong Jin
공과대학 (신소재공학부)
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