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The Impact of Liquid Cooling on 3D Multi-Core Processors

Authors
Sung Woo Chung
Publisher
IEEE
Citation
IEEE International Conference on Computer Design
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/67420
Conference Name
IEEE International Conference on Computer Design
Place
US
Conference Date
2009-10-05
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Graduate School > Department of Computer Science and Engineering > 2. Conference Papers

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