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Surface and transport properties of liquid Ag-Sn alloys and a case study of Ag-Sn eutectic solder

Authors
Novakovic, R.Delsante, S.Lee, J.Borzone, G.
Issue Date
10월-2018
Publisher
SPRINGER
Citation
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.29, no.20, pp.17108 - 17121
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume
29
Number
20
Start Page
17108
End Page
17121
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/72543
DOI
10.1007/s10854-018-9897-z
ISSN
0957-4522
Abstract
This review represents the state of the art in the thermophysical properties of liquid Ag-Sn alloys highlighting the surface and wetting properties of Ag-Sn eutectic solder. It includes an atomistic approach developed within the framework of statistical mechanical theory in conjunction with a Quasi Lattice Theory that, through a rigorous mathematical formalism, provides exact relationships between the properties in terms of classical thermodynamics. The model predicted property values are substantiated by available experimental data. Based on the phase diagram evidence about the existence of epsilon-Ag3Sn intermetallic compound, the surface (surface tension and surface composition), transport (viscosity and diffusivity) properties and microscopic functions (concentration fluctuations in the long-wavelength limit and chemical short-range order parameter) have been studied using the Compound Formation Model in a weak interaction approximation and Quasi Chemical Approximation for regular solutions. A case study of Ag-Sn eutectic alloy is presented. Taking into account its importance for design and development of lead free solder alternatives, the literature data on the wettability and the phases formed at the interface between Ag-Sn eutectic alloy and different substrates (Cu, Ni, Au, Pd) have also been analysed.
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