솔더내 (Cu,Ni)6Sn5 석출물과 Ni 기판의 상호반응
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Huh, Joo Youl | - |
dc.date.accessioned | 2021-09-02T06:01:09Z | - |
dc.date.available | 2021-09-02T06:01:09Z | - |
dc.date.created | 2021-04-22 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/72974 | - |
dc.publisher | 한국마이크로전자 및 패키징학회 | - |
dc.title | 솔더내 (Cu,Ni)6Sn5 석출물과 Ni 기판의 상호반응 | - |
dc.type | Conference | - |
dc.contributor.affiliatedAuthor | Huh, Joo Youl | - |
dc.identifier.bibliographicCitation | 한국마이크로전자 및 패키징학회 추계학술대회 | - |
dc.relation.isPartOf | 한국마이크로전자 및 패키징학회 추계학술대회 | - |
dc.citation.title | 한국마이크로전자 및 패키징학회 추계학술대회 | - |
dc.citation.conferencePlace | KO | - |
dc.citation.conferenceDate | 2008-11-14 | - |
dc.type.rims | CONF | - |
dc.description.journalClass | 2 | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
(02841) 서울특별시 성북구 안암로 14502-3290-1114
COPYRIGHT © 2021 Korea University. All Rights Reserved.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.