솔더내 (Cu,Ni)6Sn5 석출물과 Ni 기판의 상호반응

Huh, Joo Youl

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솔더내 (Cu,Ni)6Sn5 석출물과 Ni 기판의 상호반응

Authors: Huh, Joo Youl

Publisher: 한국마이크로전자 및 패키징학회

Citation: 한국마이크로전자 및 패키징학회 추계학술대회

URI: https://scholar.korea.ac.kr/handle/2021.sw.korea/72974

Conference Name: 한국마이크로전자 및 패키징학회 추계학술대회

Place: KO

Conference Date: 2008-11-14

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Appears in Collections: College of Engineering > Department of Materials Science and Engineering > 2. Conference Papers

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