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Uniform-Field Over-Mode Waveguide for Spatial Power-Combining Applications

Authors
Yi, C.Lee, H.Lee, K. J.Joo, J. H.Kwon, J. B.Kim, M.
Issue Date
1월-2018
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Millimeter-wave power amplifiers; over-mode waveguide; spatial power combining
Citation
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.28, no.1, pp.10 - 12
Indexed
SCIE
SCOPUS
Journal Title
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Volume
28
Number
1
Start Page
10
End Page
12
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/78481
DOI
10.1109/LMWC.2017.2771475
ISSN
1531-1309
Abstract
A new and effective millimeter-wave waveguide packaging technique suitable for 1-D spatial power-combining applications is presented. The transition structure using narrow corporate channels preserves the uniform field distribution when expanding the E-plane width of a standard waveguide to several wavelengths. A Q-band test module, containing back-to-back transitions for an increased width from 2.84 to 52 mm, shows an average insertion loss of 0.34 dB in the 40-50-GHz range. The radiation patterns from an open-end module, cut in half from the original test module, confirm uniform field distribution across the over-mode guide aperture.
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