Uniform-Field Over-Mode Waveguide for Spatial Power-Combining Applications
- Authors
- Yi, C.; Lee, H.; Lee, K. J.; Joo, J. H.; Kwon, J. B.; Kim, M.
- Issue Date
- 1월-2018
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Millimeter-wave power amplifiers; over-mode waveguide; spatial power combining
- Citation
- IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.28, no.1, pp.10 - 12
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
- Volume
- 28
- Number
- 1
- Start Page
- 10
- End Page
- 12
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/78481
- DOI
- 10.1109/LMWC.2017.2771475
- ISSN
- 1531-1309
- Abstract
- A new and effective millimeter-wave waveguide packaging technique suitable for 1-D spatial power-combining applications is presented. The transition structure using narrow corporate channels preserves the uniform field distribution when expanding the E-plane width of a standard waveguide to several wavelengths. A Q-band test module, containing back-to-back transitions for an increased width from 2.84 to 52 mm, shows an average insertion loss of 0.34 dB in the 40-50-GHz range. The radiation patterns from an open-end module, cut in half from the original test module, confirm uniform field distribution across the over-mode guide aperture.
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Collections - College of Engineering > School of Electrical Engineering > 1. Journal Articles
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