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Influence of High-Energy Proton Irradiation on beta-Ga2O3 Nanobelt Field-Effect Transistors

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dc.contributor.authorYang, Gwangseok-
dc.contributor.authorJang, Soohwan-
dc.contributor.authorRen, Fan-
dc.contributor.authorPearton, Stephen J.-
dc.contributor.authorKim, Jihynn-
dc.date.accessioned2021-09-02T23:00:13Z-
dc.date.available2021-09-02T23:00:13Z-
dc.date.created2021-06-19-
dc.date.issued2017-11-22-
dc.identifier.issn1944-8244-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/81519-
dc.description.abstractThe robust radiation resistance of wide-band gap materials is advantageous for space applications, where the high-energy particle irradiation deteriorates the performance of electronic devices. We report on the effects of proton irradiation of beta-Ga2O3 nanobelts, whose energy band gap is similar to 4.85 eV at room temperature. Back-gated field-effect transistor (FET) based on exfoliated quasi-two-dimensional beta-Ga2O3 nanobelts were exposed to a 10 MeV proton beam. The proton-dose- and time-dependent characteristics of the radiation-damaged FETs were systematically analyzed. A 73% decrease in the field-effect mobility and a positive shift of the threshold voltage were observed after proton irradiation at a fluence of 2 x 10(15) cm(-2). Greater radiation-induced degradation occurs in the conductive channel of the beta-Ga2O3 nanobelt than at the contact between the metal and beta-Ga2O3. The on/off ratio of the exfoliated beta-Ga2O3 FETs was maintained even after proton doses up to 2 x 10(15) cm(-2). The radiation -induced damage in the beta-Ga2O3-based FETs was significantly recovered after rapid thermal annealing at 500 degrees C. The outstanding radiation durability of beta-Ga2O3 renders it a promising building block for space applications.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherAMER CHEMICAL SOC-
dc.subjectGAN-
dc.subjectMOBILITY-
dc.subjectDIODES-
dc.subjectDAMAGE-
dc.subjectSI-
dc.titleInfluence of High-Energy Proton Irradiation on beta-Ga2O3 Nanobelt Field-Effect Transistors-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Jihynn-
dc.identifier.doi10.1021/acsami.7b13881-
dc.identifier.scopusid2-s2.0-85035052862-
dc.identifier.wosid000416614600067-
dc.identifier.bibliographicCitationACS APPLIED MATERIALS & INTERFACES, v.9, no.46, pp.40471 - 40476-
dc.relation.isPartOfACS APPLIED MATERIALS & INTERFACES-
dc.citation.titleACS APPLIED MATERIALS & INTERFACES-
dc.citation.volume9-
dc.citation.number46-
dc.citation.startPage40471-
dc.citation.endPage40476-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusGAN-
dc.subject.keywordPlusMOBILITY-
dc.subject.keywordPlusDIODES-
dc.subject.keywordPlusDAMAGE-
dc.subject.keywordPlusSI-
dc.subject.keywordAuthorgallium oxide-
dc.subject.keywordAuthorwide-band gap semiconductors-
dc.subject.keywordAuthorproton irradiation-
dc.subject.keywordAuthortwo-dimensional materials-
dc.subject.keywordAuthorthermal annealing-
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