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Unraveling the Issue of Ag Migration in Printable Source/Drain Electrodes Compatible with Versatile Solution-Processed Oxide Semiconductors for Printed Thin-Film Transistor Applications

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dc.contributor.authorHong, Gyu Ri-
dc.contributor.authorLee, Sun Sook-
dc.contributor.authorPark, Hye Jin-
dc.contributor.authorJo, Yejin-
dc.contributor.authorKim, Ju Young-
dc.contributor.authorLee, Hoi Sung-
dc.contributor.authorKang, Yun Chan-
dc.contributor.authorRyu, Beyong-Hwan-
dc.contributor.authorSong, Aeran-
dc.contributor.authorChung, Kwun-Bum-
dc.contributor.authorChoi, Youngmin-
dc.contributor.authorJeong, Sunho-
dc.date.accessioned2021-09-03T07:04:08Z-
dc.date.available2021-09-03T07:04:08Z-
dc.date.created2021-06-16-
dc.date.issued2017-04-26-
dc.identifier.issn1944-8244-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/83719-
dc.description.abstractIn recent decades, solution-processable, printable oxide thin-film transistors have garnered a tremendous amount of attention given their potential for use in low-cost, large-area electronics. However, printable metallic source/drain electrodes undergo undesirable electrical/thermal migration at an interfacial stack of the oxide semiconductor and metal electrode. In this study, we report oleic acid-capped Ag nanoparticles that effectively suppress the significant Ag migration and facilitate high field-effect mobilities in oxide transistors. The origin of the role of surface-capped Ag nanoparticles is clarified with comparative studies based on X-ray photoelectron spectroscopy and X-ray absorption spectroscopy.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherAMER CHEMICAL SOC-
dc.subjectFIELD-EFFECT TRANSISTORS-
dc.subjectFREE CU NANOPARTICLES-
dc.subjectZINC-OXIDE-
dc.subjectPERFORMANCE-
dc.subjectINK-
dc.subjectTEMPERATURE-
dc.subjectFEATURES-
dc.subjectDESIGN-
dc.subjectLAYER-
dc.titleUnraveling the Issue of Ag Migration in Printable Source/Drain Electrodes Compatible with Versatile Solution-Processed Oxide Semiconductors for Printed Thin-Film Transistor Applications-
dc.typeArticle-
dc.contributor.affiliatedAuthorKang, Yun Chan-
dc.identifier.doi10.1021/acsami.7b00524-
dc.identifier.scopusid2-s2.0-85018799540-
dc.identifier.wosid000400321800028-
dc.identifier.bibliographicCitationACS APPLIED MATERIALS & INTERFACES, v.9, no.16, pp.14058 - 14066-
dc.relation.isPartOfACS APPLIED MATERIALS & INTERFACES-
dc.citation.titleACS APPLIED MATERIALS & INTERFACES-
dc.citation.volume9-
dc.citation.number16-
dc.citation.startPage14058-
dc.citation.endPage14066-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusFIELD-EFFECT TRANSISTORS-
dc.subject.keywordPlusFREE CU NANOPARTICLES-
dc.subject.keywordPlusZINC-OXIDE-
dc.subject.keywordPlusPERFORMANCE-
dc.subject.keywordPlusINK-
dc.subject.keywordPlusTEMPERATURE-
dc.subject.keywordPlusFEATURES-
dc.subject.keywordPlusDESIGN-
dc.subject.keywordPlusLAYER-
dc.subject.keywordAuthormigration-
dc.subject.keywordAuthorprint-
dc.subject.keywordAuthorsolution-process-
dc.subject.keywordAuthortransistor-
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