Channel width dependence of electrical characteristics of a-Si:H TFTs under bending stresses
DC Field | Value | Language |
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dc.contributor.author | Oh, Hyungon | - |
dc.contributor.author | Cho, Kyoungah | - |
dc.contributor.author | Kim, Sangsig | - |
dc.date.accessioned | 2021-09-03T07:54:56Z | - |
dc.date.available | 2021-09-03T07:54:56Z | - |
dc.date.created | 2021-06-16 | - |
dc.date.issued | 2017-04 | - |
dc.identifier.issn | 0268-1242 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/83998 | - |
dc.description.abstract | In this study, we investigate the electrical characteristics of bendable a-Si:H thin-film transistors (TFTs) with various channel widths as a function of bending stress. Compared with a narrower channel TFT, a wider channel TFT exhibits a stable performance even at a bending strain of 1.3%. Our stress and strain distribution analysis reveals an inverse relationship between the channel width and the channel stress. As the channel width widens from 8 to 50 mu m, the stress experienced by the middle channel region decreases from 545 to 277 MPa. Moreover, a 50 mu m-channel-width TFT operates stably even after a 15 000 bending cycle while the 8 mu m-channel-width TFT fails to operate after a 2000 bending cycle. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.subject | MECHANICAL-PROPERTIES | - |
dc.subject | SILICON | - |
dc.subject | DISPLAYS | - |
dc.subject | DEVICES | - |
dc.subject | FILMS | - |
dc.title | Channel width dependence of electrical characteristics of a-Si:H TFTs under bending stresses | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Cho, Kyoungah | - |
dc.contributor.affiliatedAuthor | Kim, Sangsig | - |
dc.identifier.doi | 10.1088/1361-6641/aa59a3 | - |
dc.identifier.scopusid | 2-s2.0-85017164553 | - |
dc.identifier.wosid | 000413490300002 | - |
dc.identifier.bibliographicCitation | SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.32, no.4 | - |
dc.relation.isPartOf | SEMICONDUCTOR SCIENCE AND TECHNOLOGY | - |
dc.citation.title | SEMICONDUCTOR SCIENCE AND TECHNOLOGY | - |
dc.citation.volume | 32 | - |
dc.citation.number | 4 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | DISPLAYS | - |
dc.subject.keywordPlus | DEVICES | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordAuthor | bending stress | - |
dc.subject.keywordAuthor | channel width | - |
dc.subject.keywordAuthor | a-Si:H TFT | - |
dc.subject.keywordAuthor | bendable TFT | - |
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