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BadUSB 취약점 분석 및 대응 방안Analysis and Countermeasure for BadUSB Vulnerability

Other Titles
Analysis and Countermeasure for BadUSB Vulnerability
Authors
서준호문종섭
Issue Date
2017
Publisher
대한임베디드공학회
Keywords
BadUSB; Integrity; Bootloader; Firmware; Code signing
Citation
대한임베디드공학회논문지, v.12, no.6, pp.359 - 368
Indexed
KCI
Journal Title
대한임베디드공학회논문지
Volume
12
Number
6
Start Page
359
End Page
368
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/85559
DOI
10.14372/IEMEK.2017.12.6.359
ISSN
1975-5066
Abstract
As the BadUSB is a vulnerability, in which a hacker tampers the firmware area of a USB flash drive. When the BadUSB device is plugged into the USB port of a host system, a malicious code acts automatically. The host system misunderstands the act of the malicious behavior as an normal behaviour for booting the USB device, so it is hard to detect the malicious code. Also, an antivirus software can’t detect the tampered firmware because it inspects not the firmware area but the storage area. Because a lot of computer peripherals (such as USB flash drive, keyboard) are connected to host system with the USB protocols, the vulnerability has a negative ripple effect. However, the countermeasure against the vulnerability is not known now. In this paper, we analyze the tampered area of the firmware when a normal USB device is changed to the BadUSB device and propose the countermeasure to verify the integrity of the area when the USB boots. The proposed method consists of two procedures. The first procedure is to verify the integrity of the area which should be fixed even if the firmware is updated. The verification method use hashes, and the target area includes descriptors. The second procedure is to verify the integrity of the changeable area when the firmware is updated. The verification method use code signing, and the target area includes the function area of the firmware. We also propose the update protocol for the proposed structure and verify it to be true through simulation.
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College of Science and Technology > Department of Electronics and Information Engineering > 1. Journal Articles

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