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Commutation failure and voltage sensitivity analysis in a hybrid multi-infeed HVDC system containing modular multilevel converter

Authors
Guo, QingleiYoon, MinhanKim, ChankiJang, Gilsoo
Issue Date
10월-2016
Publisher
WILEY-BLACKWELL
Keywords
commutation failure immunity index; hybrid multi-infeed HVDC; line-commutated converter; modular multilevel converter; voltage sensitivity
Citation
INTERNATIONAL TRANSACTIONS ON ELECTRICAL ENERGY SYSTEMS, v.26, no.10, pp.2259 - 2271
Indexed
SCIE
SCOPUS
Journal Title
INTERNATIONAL TRANSACTIONS ON ELECTRICAL ENERGY SYSTEMS
Volume
26
Number
10
Start Page
2259
End Page
2271
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/87337
DOI
10.1002/etep.2206
ISSN
2050-7038
Abstract
A typical hybrid dual-infeed high-voltage direct current (HVDC) system includes two types of linksline-commutated converter (LCC) HVDC and voltage-source converter (VSC) HVDC in proximity. When faults occur in the LCC-HVDC side, the VSC-HVDC link sufficiently can compensate power to the LCC-HVDC system; thus, voltage fluctuation is suppressed. In recent years, the modular multilevel converter (MMC) has been a promising type of VSC. This paper presents a novel hybrid dual-infeed HVDC system consisting of an LCC-HVDC link and an MMC-HVDC link, and the two links are interconnected through a tie line between buses in the inverter side. The positive contribution of the MMC-HVDC link to the LCC-HVDC link in the area of commutation failure immunity index, effective short circuit ratio, voltage sensitivity factor, temporary overvoltage, and DC line fault recovery are investigated. Investigations show that the stability of system has been enhanced significantly with MMC, and the contributors are physical structure change and the control strategy of the MMC-HVDC system. The modelling and simulation of the steady state and transient performance of hybrid HVDC system are conducted in PSCAD/EMTDC. Finally, the simulation results verify the enhancement in sensitivity and stability of the dual-infeed HVDC system. Copyright (c) 2016 John Wiley & Sons, Ltd.
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공과대학 (전기전자공학부)
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