Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate
- Authors
- Lee, Jong-Gun; Kim, Do-Yeon; Kang, Byungjun; Kim, Donghwan; Al-Deyab, Salem S.; James, Scott C.; Yoon, Sam S.
- Issue Date
- 10월-2015
- Publisher
- ELSEVIER
- Keywords
- Supersonic spray deposition; Copper nickel electrode; Particle impact; Multi-particle
- Citation
- COMPUTATIONAL MATERIALS SCIENCE, v.108, pp.114 - 120
- Indexed
- SCIE
SCOPUS
- Journal Title
- COMPUTATIONAL MATERIALS SCIENCE
- Volume
- 108
- Start Page
- 114
- End Page
- 120
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/92411
- DOI
- 10.1016/j.commatsci.2015.06.016
- ISSN
- 0927-0256
- Abstract
- Copper and nickel nanoparticles are supersonically sprayed onto a silicon wafer to install a low-resistance, high-performance, and cost-competitive front electrode onto a crystalline silicon solar cell. Impact phenomena and the deposition processes of both single and multiple particles were simulated and the computational results were compared against experimental data. Jet formation and local sintering at the particle-to-substrate interface were observed due to adiabatic shear instabilities. Local temperatures increased with impact velocity and estimates of these temperatures were made with a simple energy balance. Multi-particle simulations reveals the processes of thin-film growth; particles are bonded through interfacial sintering that locks the particles into a film. Film plastic strains were highest at the interface and increase risks for delamination. (C) 2015 Elsevier B.V. All rights reserved.
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- Appears in
Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
- College of Engineering > Department of Mechanical Engineering > 1. Journal Articles
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