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Barrier lowering and leakage current reduction in Ni-AlGaN/GaN Schottky diodes with an oxygen-treated GaN cap layer

Authors
Woo, HyeonseokLee, JongkyongJo, YongcheolHan, JaeseokKim, JongminKim, HyungsangRoh, Cheong HyunLee, Jun HoPark, JunghoHahn, Cheol-KooIm, Hyunsik
Issue Date
9월-2015
Publisher
ELSEVIER SCIENCE BV
Keywords
AlGaN/GaN device; Schottky barrier diode; Turn-on voltage; Interface state density; Surface treatment; Oxygen annealing
Citation
CURRENT APPLIED PHYSICS, v.15, no.9, pp.1027 - 1031
Indexed
SCIE
SCOPUS
KCI
Journal Title
CURRENT APPLIED PHYSICS
Volume
15
Number
9
Start Page
1027
End Page
1031
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/92589
DOI
10.1016/j.cap.2015.06.004
ISSN
1567-1739
Abstract
We report on the effect of oxygen annealing for GaN surface on the Schottky barrier configuration and leakage current in Ni-AlGaN/GaN Schottky barrier diodes. After oxygen annealing, their turn-on voltage and reverse- bias leakage current characteristics are significantly improved due to a reduction in the Schottky barrier height (SBH) and suppression in the surface states respectively. Interface state density extracted from the Terman method was reduced by 2 orders of magnitude. X-ray photoelectron spectroscopy measurements show that the oxygen annealing induces Ga2O3 on the GaN surface. The formation of Ga2O3 reduces the interface state density as well as lowers the SBH through the modification of hybridized metal induced gap states. (C) 2015 Elsevier B.V. All rights reserved.
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