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Nickel-copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray

Authors
Lee, Jong-GunKim, Do-YeonKang, ByungjunKim, DonghwanSong, Hee-eunKim, JooyoungJung, WoonsukLee, DukhaengAl-Deyab, Salem S.James, Scott C.Yoon, Sam S.
Issue Date
7월-2015
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Keywords
Silicon solar cell; Nickel-copper electrode; Supersonic cold spraying; Contact resistivity; Specific resistivity
Citation
ACTA MATERIALIA, v.93, pp.156 - 163
Indexed
SCIE
SCOPUS
Journal Title
ACTA MATERIALIA
Volume
93
Start Page
156
End Page
163
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/93193
DOI
10.1016/j.actamat.2015.04.012
ISSN
1359-6454
Abstract
High-performance electrodes are fabricated through supersonic spraying of nickel and copper particles. These electrodes yield low specific resistivities, comparable to electrodes produced by screen-printed silver paste and light-induced plating. The appeal of this fabrication method is the low cost of copper and large area scalability of supersonic spray-coating techniques. The copper and nickel electrode was fabricated in the open air without any pre- or post-treatment. The spray-coated copper nickel electrode was characterized by optical microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction, and energy dispersive spectroscopy. Although both SEM and TEM images confirmed voids trapped between flattened particles in the fabricated electrode, this electrode's resistivity was order 10(-6) Omega cm, which is comparable to the bulk value for pure copper. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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KIM, Dong hwan
공과대학 (신소재공학부)
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