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Effect of Sn Doping on the Thermoelectric Properties of n-type Bi-2(Te,Se)(3) Alloys

Authors
Lee, Jae-UkLee, Deuk-HeeKwon, BeomjinHyun, Dow-BinNahm, SahnBaek, Seung-HyubKim, Jin-Sang
Issue Date
6월-2015
Publisher
SPRINGER
Keywords
Bismuth telluride; thermoelectric; Sn doping; mechanical deformation; hot press
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.44, no.6, pp.1926 - 1930
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF ELECTRONIC MATERIALS
Volume
44
Number
6
Start Page
1926
End Page
1930
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/93364
DOI
10.1007/s11664-014-3598-z
ISSN
0361-5235
Abstract
In the present work, 0.01-0.05wt.% Sn-doped Bi-2(Te0.9Se0.1)(3) alloys were prepared by mechanical deformation followed by hot pressing, and their thermoelectric properties were studied. We observed that the Sn element is a very effective dopant as an acceptor to control the carrier concentration in the n-type Bi-2(Te0.9Se0.1)(3) alloys to optimize their thermoelectric property. The n-type carrier concentration can be controlled from 4.2 x 10(19)/cm(3) to 2.4 x 10(19)/cm(3) by 0.05wt.% Sn-doping. While the Seebeck coefficient and the electrical resistivity are both increased with doping, the power factor remains the same. Therefore, we found that the thermoelectric figure-of-merit becomes maximized at 0.75 when the thermal conductivity has a minimum value for the 0.03wt.% Sn-doped sample.
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