Effects of Processing Temperatures of Nickel Plating on Capacitance Density of Alumina Film Capacitor
- Authors
- Jeong, Myung-Sun; Ju, Byeong-Kwon; Lee, Jeon-Kook
- Issue Date
- Jun-2015
- Publisher
- AMER SCIENTIFIC PUBLISHERS
- Keywords
- Alumina Film Capacitor; Electroless Plating; Alumina Nano-Channel; Nickel Electrode; Processing Temperature
- Citation
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.15, no.6, pp.4530 - 4533
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
- Volume
- 15
- Number
- 6
- Start Page
- 4530
- End Page
- 4533
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/93422
- DOI
- 10.1166/jnn.2015.9781
- ISSN
- 1533-4880
- Abstract
- We observed the effects of nickel plating temperatures for controlling the surface morphologies of the deposited nickel layers on the alumina nano-pores. The alumina nano-channels were filled with nickel at various processing temperatures of 60 similar to 90 degrees C. The electrical properties of the alumina film capacitors were changed with processing temperatures. The electroless nickel plating (ENP) at 60 degrees C improved the nickel penetration into the alumina nano-channels due to the reduced reaction rate. Nickel layers are uniformly formed on the high aspect ratio alumina pores. Due to the uniform nickel electrode, the capacitance density of the alumina film capacitors is improved by the low leakage current, dissipation factor and equivalent series resistance. Alumina film capacitors made by ENP at 60 degrees C had a high capacitance density of 160 nF/cm(2).
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - College of Engineering > School of Electrical Engineering > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholar.korea.ac.kr/handle/2021.sw.korea/93422)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.