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Thermal and Mechanical Properties of EMC for Fan Out Wafer Level PackagesThermal and Mechanical Properties of EMC for Fan Out Wafer Level Packages
- Alternative Title
- Thermal and Mechanical Properties of EMC for Fan Out Wafer Level Packages
- Authors
- Yoon, Ho Gyu
- Issue Date
- 11-Oct-2019
- Conference Name
- 2019 추계학술대회 연구논문 초록집
- Place
- 대한민국
- Conference Date
- 2019-10-10 ~ 2019-10-11
- Conference Name
- 한국고분자학회
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Collections - College of Engineering > ETC > 2. Conference Papers
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