First integration of Ni barrier layer for enhanced threshold switching characteristics in Ag/HfO 2-based TS device

  • Chu, Daeyoung; 
  • Kang, Sanghyun; 
  • Kim, Gwon; 
  • Sung, Juho; 
  • Lim, Jaehyuk; 
  • ... Shin, Changhwan; 
  • 외 2명
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초록

Utilizing Ag/HfO 2 with nickel (Ni) as a barrier layer, a novel threshold switching (TS) device is devised to overcome challenges such as low reliability, high threshold voltage, and high leakage current. Compared against an Ag/Ti/HfO 2 -based TS device, the Ag/Ni/HfO 2 -based TS device exhibits improved electrical characteristics: yield enhancement from 31.7 % to 40.0 %, enhanced endurance from -10 cycles to -300 cycles, and suppression in off -state current (I OFF ) from 1.2 x 10 - 7 A to 5.2 x 10 -10 A under a high compliance current (e.g., 10 -4 A). The results obtained through transmission electron microscopy (TEM), energy-dispersive X-ray spectroscopy (EDS), and atomic force microscopy (AFM) support the evidence of those accomplishments. Reducing the effective area of the TS device improves control over erratically generated filaments and the electric field within the switching layer, resulting in enhanced performance such as a reduced threshold voltage (V TH -0.35 V), minimized V TH variability (-0.01 V), decreased a threshold current (I TH , i.e., the leakage current in the offstate before activation, -5.2 x 10 -10 A), and maximum conductance (-5.0 x 10 -5 S) of low-resistance state. These findings suggest that the optimized Ag/Ni/HfO 2 -based TS device can serve as a practical solution for lowpower applications.

키워드

Threshold switching; Ag/HfO2-based TS device; Ni barrier layer; Ag ions; Oxygen vacancy; Reducing the effective area; FIELD-EFFECT TRANSISTOR; TRANSITION; DIFFUSION; ELECTRODE; DYNAMICS; DEFECTS
제목
First integration of Ni barrier layer for enhanced threshold switching characteristics in Ag/HfO 2-based TS device
저자
Chu, Daeyoung; Kang, Sanghyun; Kim, Gwon; Sung, Juho; Lim, Jaehyuk; Choi, Yejoo; Han, Donghwan; Shin, Changhwan
DOI
10.1016/j.mtadv.2024.100492
발행일
2024-06
유형
Article
저널명
Materials Today Advances
권
22