Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires
DC Field | Value | Language |
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dc.contributor.author | Lee, Won Seok | - |
dc.contributor.author | Won, Sejeong | - |
dc.contributor.author | Park, Jeunghee | - |
dc.contributor.author | Lee, Jihye | - |
dc.contributor.author | Park, Inkyu | - |
dc.date.accessioned | 2021-09-06T10:52:11Z | - |
dc.date.available | 2021-09-06T10:52:11Z | - |
dc.date.created | 2021-06-19 | - |
dc.date.issued | 2012 | - |
dc.identifier.issn | 2040-3364 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/106271 | - |
dc.description.abstract | Controlled alignment and mechanically robust bonding between nanowires (NWs) and electrodes are essential requirements for reliable operation of functional NW-based electronic devices. In this work, we developed a novel process for the alignment and bonding between NWs and metal electrodes by using thermo-compressive transfer printing. In this process, bottom-up synthesized NWs were aligned in parallel by shear loading onto the intermediate substrate and then finally transferred onto the target substrate with low melting temperature metal electrodes. In particular, multi-layer (e.g. Cr/Au/In/Au and Cr/Cu/In/Au) metal electrodes are softened at low temperatures (below 100 degrees C) and facilitate submergence of aligned NWs into the surface of electrodes at a moderate pressure (similar to 5 bar). By using this thermo-compressive transfer printing process, robust electrical and mechanical contact between NWs and metal electrodes can be realized. This method is believed to be very useful for the large-area fabrication of NW-based electrical devices with improved mechanical robustness, electrical contact resistance, and reliability. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ROYAL SOC CHEMISTRY | - |
dc.subject | FIELD-EFFECT TRANSISTORS | - |
dc.subject | ROOM-TEMPERATURE | - |
dc.subject | ZNO NANOWIRES | - |
dc.subject | FABRICATION | - |
dc.subject | SENSORS | - |
dc.subject | INTERDIFFUSION | - |
dc.subject | COUPLES | - |
dc.subject | ARRAYS | - |
dc.subject | AU | - |
dc.title | Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jeunghee | - |
dc.identifier.doi | 10.1039/c2nr30392b | - |
dc.identifier.scopusid | 2-s2.0-84861378536 | - |
dc.identifier.wosid | 000304145900021 | - |
dc.identifier.bibliographicCitation | NANOSCALE, v.4, no.11, pp.3444 - 3449 | - |
dc.relation.isPartOf | NANOSCALE | - |
dc.citation.title | NANOSCALE | - |
dc.citation.volume | 4 | - |
dc.citation.number | 11 | - |
dc.citation.startPage | 3444 | - |
dc.citation.endPage | 3449 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | FIELD-EFFECT TRANSISTORS | - |
dc.subject.keywordPlus | ROOM-TEMPERATURE | - |
dc.subject.keywordPlus | ZNO NANOWIRES | - |
dc.subject.keywordPlus | FABRICATION | - |
dc.subject.keywordPlus | SENSORS | - |
dc.subject.keywordPlus | INTERDIFFUSION | - |
dc.subject.keywordPlus | COUPLES | - |
dc.subject.keywordPlus | ARRAYS | - |
dc.subject.keywordPlus | AU | - |
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