Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires
- Authors
- Lee, Won Seok; Won, Sejeong; Park, Jeunghee; Lee, Jihye; Park, Inkyu
- Issue Date
- 2012
- Publisher
- ROYAL SOC CHEMISTRY
- Citation
- NANOSCALE, v.4, no.11, pp.3444 - 3449
- Indexed
- SCIE
SCOPUS
- Journal Title
- NANOSCALE
- Volume
- 4
- Number
- 11
- Start Page
- 3444
- End Page
- 3449
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/106271
- DOI
- 10.1039/c2nr30392b
- ISSN
- 2040-3364
- Abstract
- Controlled alignment and mechanically robust bonding between nanowires (NWs) and electrodes are essential requirements for reliable operation of functional NW-based electronic devices. In this work, we developed a novel process for the alignment and bonding between NWs and metal electrodes by using thermo-compressive transfer printing. In this process, bottom-up synthesized NWs were aligned in parallel by shear loading onto the intermediate substrate and then finally transferred onto the target substrate with low melting temperature metal electrodes. In particular, multi-layer (e.g. Cr/Au/In/Au and Cr/Cu/In/Au) metal electrodes are softened at low temperatures (below 100 degrees C) and facilitate submergence of aligned NWs into the surface of electrodes at a moderate pressure (similar to 5 bar). By using this thermo-compressive transfer printing process, robust electrical and mechanical contact between NWs and metal electrodes can be realized. This method is believed to be very useful for the large-area fabrication of NW-based electrical devices with improved mechanical robustness, electrical contact resistance, and reliability.
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Collections - Graduate School > Department of Advanced Materials Chemistry > 1. Journal Articles
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